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ABSTRACT In order to improve machining efficiency of sapphire wafer machining using the conventional loose abrasive process, fixed-abrasive diamond plates are investigated in this study for sapphire wafer grinding. Four vitrified bond diamond plates of different grain sizes (40 µm, 20 µm, 7 µm, and 2.5 µm) are developed and …
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1. Sapphire Processing Process 1.1 Sapphire Substrate Wafer Process. From the sapphire ingot to the final substrate sapphire wafer, it mainly includes the following steps: crystal growth → crystal pulling → head and tail truncation → rolling grinding → crystal rod orientation → slicing → chamfering and edge grinding → rough …
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Sapphire Substrate, Edge Grinding, Ch amfer Length, Uniformity 1, 1, 2, 1*, 1, 1
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Chamfering sapphire. Metal bond diamond edge grinding wheel is used to trim the wafer edge into an arc shape to improve the mechanical strength of the wafer edge and avoid …
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders "W-GM series" process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and …
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The core of the Saturn Grinder is its cutting-edge grinding mechanism. Equipped with sharp teeth and a precise grind system, it easily achieves your desired texture, from fine to coarse, with flawless efficiency. ... SAPPHIRE. VELVET. This Grinder was meticulously crafted utilizing advanced 3D technology, showcasing a precision ...
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This wheel is used for edge grinding (beveling) semiconductor wafers. We offer "ME" bond for wheels for chamfering silicon wafers with excellent sharpness and high maintenance of groove shape. The finished surface …
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Cutting-edge coolants to meet your grinding demands. Our Products. Glass Coolants; Technical Ceramics, Quartz, and Sapphire; Optical Coolants; Specialty Metal Coolants; Stone Coolants ... Quartz, and Sapphire. Our coolants will help you achieve the ultra-low Ra's you demand by utilizing high amounts of specialized lubrication components ...
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growth (sapphire ingots), edge grinding, slicing, lapping, sur-face polishing and cleaning.[6,7] Among these processes, lap-ping is one of the most important processes controlling the
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Edge Grinding — Aptek Industries Inc. Edge grinding, aka Edge Profiling, is critical to the manufacturing of all semiconductor wafers and wafers that are used in the manufacture …
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Sapphire is a variety of the mineral co-rundum, an aluminium oxide. Com-pared to other glass-like materials, sapphire has some important techni-cal advantages. Because of its high Mohs hardness, sapphire is the hard-est natural substance next to diamond. Sapphire is significantly stronger and more resistant to scratches and abra-
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Uniform grinding on top and bottom layer with high edge strength; Long-lasting groove profile; Double meshes for rough and find grinding are applicables in on wheel; Applications. LCD panel, bare glass, and sapphire wafer edge grinding
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Edge Profiling (or Grinding), and Edge Trimming are specific backgrinding technologies that employ precise diamond grinding wheels within the robust, precision …
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We know that one grind doesn't work for everyone or for every occasion and that's why we're offering 3 different grinding plates. Each grinding plate produces a consistent, uniform, chunkless grind with fast flow-through. Whatever your preference, we got you covered. You can swap out the middle grinding plate to change your grind size in an ...
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The SiC-reinforced resin-bonded diamond wheel possesses favorable self-sharpening ability and sufficient diamond grain retention capacity for sapphire grinding. …
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Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding. Metal diamond wheel for rough grinding to get accurate edge profile.
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The SiC-reinforced resin-bonded diamond wheel possesses favorable self-sharpening ability and sufficient diamond grain retention capacity for sapphire grinding. The wear distribution shows that the most severe wear parts of the grinding wheel are at the edge and the center of the grinding zone, which is consistent with the …
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Features of edge diamond wheel for silicon and sapphire wafer. – Grinded with uniform chamfer width, excellent rigidity. – Strong groove shape retention, long life. – By edge grinding the final diameter is adjusted. – …
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The modular concept to make the optimum process line possible. Low damage grinding method is available, Mirror Finish. Machine specification ready for 2" to 6" wafer or for 4" …
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The edge grinders "W-GM series" process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated …
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Double-sided planetary grinding as an efficient and precise machining method is used for the rapid thinning and flattening process of sapphire substrate.
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Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding. Metal diamond wheel for rough grinding to get accurate edge profile.
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Company. CEO's Message; Company History; Patents and Certifications; Organization; Location; Manufacturing; Products. Electronic Tools. Semiconductor Industry
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1. Introduction. Sapphire exhibits good mechanical and optical properties as well as thermal and chemical stability. In addition, it has high hardness, strong wear and corrosion resistance, high light transmittance and further superior properties [1, 2].Thus, it is widely used in semiconductor and in the fields of aerospace, national defence and …
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Fig. 3 is the geometric model of sapphire micro-slot-grinding considering different crystal orientations. The diameter of grinding tool this study used is 0.5 mm, the wafer of sapphire is fixed on a worktable, then micro-slots were produced on workpiece surface with the feeding movement of high-speed revolving grinding tool.As can be …
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This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. ... High quality sapphire processing; Reducing wafer edge chipping by optimizing the fine grinding amount; Improving TTV ...
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Suitable for silicon wafer by in-feed edge grinding with high quality process (#3000) UH-I-8100 / UH-I-8800. Edge grinder for 4" to 8" substrate, which enables accurate direction …
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An ultra-precision grinding system with a fully hydrostatic module was erected to suppress surface and subsurface damage. As shown in Fig. 1 a, where the grinding spindle and three linear axes (X, Y, Z) are hydrostatic and the workpiece spindle (C) is aerostatic.The accuracy, stiffness, damping and vibration absorption of the whole system are excellent, …
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Chamfering sapphire Metal bond diamond edge grinding wheel is used to trim the wafer edge into an arc shape to improve the mechanical strength of the wafer edge and avoid defects caused by stress concentration. The …
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